Redistribution metal and under bump metal interconnect structures and method

ABSTRACT

An integrated circuit die includes a metal layer, a first passivation layer disposed above the metal layer, an aluminum containing redistribution layer disposed above the first passivation layer, an under bump metallization layer, and a redistribution layer plug. The redistribution layer plug is coupled to the metal layer and disposed in a via in the first passivation layer. The under bump metallization layer is coupled to the aluminum containing redistribution layer above the first passivation layer at a distance from the redistribution layer plug.

BACKGROUND OF THE DISCLOSURE

One or more integrated circuits (ICs) are provided in a module orpackage. The IC is generally provided on a die that is connected by finewires or by solder bumps to the package substrate or other die. The dieoften includes one or more under bump metallization (UBM) features thatconnect top metal layer features to the package substrate. Aredistribution layer (RDL) is a metal layer on the die that makes theconnection to at least one top metal layer feature available at otherlocations. The RDL layer can be used to facilitate or enable theconnection of the top metal feature to the package substrate, otherdies, other input/output (I/O) pads, other top metal features, etc.

BRIEF DESCRIPTION OF THE DRAWINGS

Various objects, aspects, features, and advantages of the disclosurewill become more apparent and better understood by referring to thedetailed description taken in conjunction with the accompanyingdrawings, in which like reference characters identify correspondingelements throughout. In the drawings, like reference numbers generallyindicate identical, functionally similar, and/or structurally similarelements.

FIG. 1 is a cross sectional view schematic drawing of a portion of an ICdie with an RDL via (RV) plug between an RDL and a metal layer accordingto some embodiments;

FIG. 2 is a cross sectional view schematic drawing of a portion of an ICdie with an RV plug between an RDL and a metal layer according to someembodiments;

FIG. 3 is a cross sectional view schematic drawing of a portion of an ICdie with an under bump metallization (UBM) layer connected to a topmetal layer through an RDL according to some embodiments;

FIG. 4 is a cross sectional view schematic drawing of a portion of an ICdie with an under bump metallization (UBM) layer connected to a topmetal layer through an RDL according to some embodiments;

FIG. 5 is a cross sectional view schematic drawing of a portion of an ICdie with an under bump metallization (UBM) layer RV plug connected to atop metal layer according to some embodiments; and

FIG. 6 is a cross sectional view schematic drawing a cross sectionalview schematic drawing of a portion of an IC die with an under bumpmetallization (UBM) layer including an RDL portion according to someembodiments.

DETAILED DESCRIPTION

Before turning to the features, which illustrate some exemplaryembodiments in detail, it should be understood that the application isnot limited to the details or methodology set forth in the descriptionor illustrated in the FIGs. It should also be understood that theterminology is for the purpose of description only and should not beregarded as limiting. Further, spatially relative terms, such as “top”,“bottom”, “beneath,” “below,” “lower,” “above,” “upper” and the like,may be used herein for ease of description to describe one element orfeature's relationship to another element(s) or feature(s) asillustrated in the FIGS. The spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the FIGS. The apparatus may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein may likewise be interpretedaccordingly.

Referring generally to the FIGs, an under bump metallization (UBM)feature is connected to a metal layer feature (e.g., top metal layer) bya via that does not require barrier material in some embodiments. Thestructures and methods for such a connection advantageously obtain finerline width and spacing by reducing the need for barrier material in thevia in some embodiments. According to some embodiments, an RV is filledwith an aluminum (Al) and a copper (Cu) plug or tungsten (Y) plug. Theplug connects the top metal layer and the RDL which is coupled to theUBM feature in some embodiments. A top of the plug (and the bottom ofthe RDL layer) includes barrier material that is substantially planar tothe to the RDL bottom surface in some embodiments.

According to some embodiments, the RDL is an Al—Cu alloy covered by adielectric layer. According to some embodiments, a Cu UBM feature or aCu plug is provided through a polyimide layer and separate from the UBMfeature and connects an Al—Cu RDL layer and the top metal layer. In someembodiments, a UBM RDL is provided above the polyimide layer and isconnected to a UBM feature coupled to the top metal layer.

In some embodiments, an Al—Cu or Cu plug is not used and disadvantagesassociated with the Al—Cu or Cu plug and barrier materials disposedwithin the via are avoided. Barrier materials include titanium, titaniumnitride, tantalum or tantalum nitride, or mixtures, combinations oralloys thereof, and are used to prevent copper used in interconnectmetallurgy from diffusing into surrounding dielectric materials such assilicon dioxide. In some embodiments, an Al—Cu alloy can be providedwithin the via between the UBM feature and a conductive barrier layer.

In some embodiments, an integrated circuit die includes a metal layer, afirst passivation layer disposed above the metal layer, a redistributionlayer disposed above the first passivation layer, an under bumpmetallization layer, and a redistribution layer plug. The redistributionlayer plug is coupled to the metal layer and disposed in a via in thefirst passivation layer. A first surface of the redistribution layerplug is substantially in-plane with a second surface of the firstpassivation layer. The under bump metallization layer is coupled to theredistribution layer above the first passivation layer at a distancefrom the redistribution layer plug.

In some embodiments, an integrated circuit die includes a metal layer, afirst passivation layer disposed above the metal layer, a conductivelayer disposed above the passivation layer, a polyimide layer disposedabove the conductive layer; and an under bump metallization layer. Theunder bump metallization layer is coupled to the metal layer through thepolyimide layer, the conductive layer, and the first passivation layer.

In some embodiments, an integrated circuit die includes a metal layer, abarrier layer above the metal layer, a first passivation layer disposedabove the barrier layer, a redistribution layer disposed above the firstpassivation layer, and a redistribution layer plug coupled to the metallayer and disposed in a via in the first passivation layer and barrierlayer. A top surface of the redistribution layer plug is disposed abovea top surface of the redistribution layer.

In some embodiments, an integrated circuit die includes a metal layer, afirst passivation layer disposed above the metal layer, a firstpolyimide layer disposed above the first a passivation layer, and anunder bump metallization layer coupled to the metal layer through thefirst polyimide layer. The under bump metallization layer includes atleast one conductor extending across a top surface of the firstpolyimide layer and away from an area for a solder bump or pillar forthe IC die.

With reference to FIG. 1, a portion of an IC die 10 includes aconductive layer 12 (e.g., a top metal layer), a dielectric layer 14, aredistribution layer (RDL) 16, a dielectric layer 18, an under bumpmetallization layer 20, and a bump structure 30. The conductive layer 12is disposed at or near a top portion of the IC die 10 and provides a pador feature for connection to external structures to the IC die 10, suchas, connections using the redistribution layer 16, under bumpmetallization layer 20 and bump structure 30. In some embodiments, thedielectric layer 14 includes a via 24 which is filled with a plug 26(e.g., an RV plug). A top surface 34 of the plug 26 is substantially inplane with a bottom surface 36 of the redistribution layer 16.

The conductive layer 12 can include a copper pad connected to one ormore conductors of the conductive layer 12. In some embodiments, abarrier layer or liner layer is provided on the sides and bottom of thecopper pad and conductors associated with the conductive layer 12. Theconductive layer 12 is provided above a top interlayer dielectric layer(IDL) for the IC die 10 (e.g., deposited or grown and selectively etchedaccording to various metal conductor IC formation techniques) in someembodiments. The IDL can be silicon dioxide deposited by atetraorthoethylsilicate (TEOS) technique or other suitable insulativematerial deposition technique. The conductive layer 12 is a conductivematerial, such as Cu, Al—Cu or other metal or alloy and is approximately0.2-2.0 micrometers (e.g., 3700-12500 Angstroms (A)) thick in someembodiments. The conductive layer 12 is an alloy of conductive materialsincluding aluminum, copper, titanium, gold, etc. in some embodiments.

The dielectric layer 14 is a capping barrier dielectric layer (CBD) insome embodiments. The dielectric layer 14 is a silicon nitride, siliconoxynitride, or other barrier layer. The dielectric layer 14 can bedeposited by plasma-enhanced chemical vapor deposition, and has athickness of approximately 300-4900 angstroms. A planarization layer isprovided above or as part of the dielectric layer 14 in someembodiments. In some embodiments, the passivation layer includingsilicon dioxide, silicon nitride, silicon oxynitride, or combinationsthereof, and planarized by chemical mechanical polishing (CMP).

The via 24 in the dielectric layer 14 is provided through the dielectriclayer 14 by selective etching (e.g., a photoresist etching process) insome embodiments. In some embodiments, dry etching selective to thematerial of dielectric layer 14 with respect to the material of theconductive layer 12 is used. The via 24 has a circular shape with adiameter of 0.2 micrometers or a square shape with a side of 0.2micrometers. Other sizes and shapes can be chosen based upon electricalparameters for the connection to the bump structure 30 and processcapabilities.

The redistribution layer 16 is an alloy of aluminum, titanium, an Al—Cualloy, copper, gold, or other conductive material. Thin film depositioninvolving chemical vapor deposition (CVD), physical vapor deposition(PVD), or electrolytic plating, sputtering deposition, evaporation, andelectroless plating processes can be utilized to form the redistributionlayer 16. The redistribution layer 16 can be 2 to 20 (e.g., 28000 A)microns thick. and deposited in a metal deposition technique andselectively etched to form conductors above the dielectric layer 14. Theredistribution layer 16 includes an aluminum pad or conductor connectedto the plug 26 in the via 24. The conductors are used to providefeatures, pads, or other conductive regions for providing connections tothe conductive layer 12.

The plug 26 is a conductive material including copper material orincluding barrier metal materials (e.g., titanium, tantalum, tungsten,etc.) preventing diffusion of materials between the redistribution layer16 and the top conductive layer 12 in some embodiments. The top surface34 of the plug 26 is substantially planer to a bottom surface 36 of theredistribution layer 16. The plug 26 extends from the redistributionlayer 16 to the top conductive layer 12. The plug 26 can be formedduring fabrication of the IC die 10 before post-fabrication processes insome embodiments. In some embodiments, the plug 26 is formed inpost-fabrication processes when subsequent layers are provided to the ICdie 10. The pug 26 is entirely copper material or an alloy thereof insome embodiments from a top surface to a bottom surface. The sidewall ofthe via 26 is in contact with the copper material of the plug 26 in someembodiment. In some embodiments, the conductive layer 16 is an aluminummaterial and barrier material is not used above the layer 14.

Advantageously, the material of redistribution layer 16 is not providedwithin the via 24 and the redistribution layer 16 is substantiallyplaner, thereby enabling finer line width and spacing due to uniformityin the thickness of the redistribution layer 16. Further, a singlepassivation layer and a single dielectric layer 18 is used in someembodiments. The top of the plug 26 is a barrier material (e.g.,titanium, tantalum, tungsten, etc.). The top of the plug 26 has a topsurface that is substantially planar with a layer of the barriermaterial above the redistribution layer 16 in some embodiments. In someembodiments, the via 24 filled with copper and planarized before 16 isdeposited. The barrier material can be planarized and etched accordingto the shape of the redistribution layer 16 in some embodiments.

The dielectric layer 18 is a polyimide material in some embodiments. Thedielectric layer 18 includes unmodified polyimides as well as modifiedpolyimides such as polyester-imides, polyimide-imide-esters,polyimide-imides, polysiloxane-imides, and mixtures of polyimides. Insome embodiments, the dielectric layer 18 is photosensitive low curingtemperature dielectric resist, photosensitive composite resist, laminatecompound film, solder mask resist film, liquid molding compound, SiO2,Si3N4, SiON, Al2O3, polyimide, or other material having similarinsulating and structural properties in some embodiments. The dielectriclayer 18 can be deposited over dielectric layer 14 and redistributionlayer 16, such as by coating, with a polyimide precursor and convertingto cured polyimide by heating. The dielectric layer 18 is from about 0.3to about 5.0 microns thick in some embodiments.

In some embodiments, the plug 26 is spaced apart by a distance from avia 40. The distance can be lateral appropriate spacing from the contactof under bump metallization layer 20. The spacing can be from 10 A tomicrons or more in some embodiments. The redistribution layer 16 allowsthe features associated with conductive layer 12 to be located atlocations other than directly under the under bump metallization layer20.

The via 40 is provided in the dielectric layer 18 for connecting theunder bump metallization layer 20 to the redistribution layer 16. Thedielectric layer 18 is selectively etched to form the via 40. The underbump metallization layer 20 can include titanium, nitride, copper, gold,titanium tungsten, or chromium, which can be deposited according to ametallization technique. In some embodiments, under bump metallizationlayer 20 can include a combination of materials such as those used inpad-limiting metallurgy. The under bump metallization layer 20 can beapproximately 100-20,000 angstroms thick.

The bump structure 30 can be a conductive structure connected directlyto the under bump metallization layer 20. The bump structure 30 can be acopper column, or copper, silver and tin solder material for makinginterconnections to package substrates. The bump structure 30 can have avariety of shapes including cylindrical, spherical, etc.

With reference to FIG. 2, a portion of an IC die 110 is similar to theIC die 10 described above with reference to FIG. 1. The IC die 110includes a dielectric layer 114 provided above the dielectric layer 14and the redistribution layer 16. The dielectric layer 114 can be asecond capping barrier dielectric layer of similar material andthickness to the dielectric layer 14. A via 124 through the dielectriclayer 14 is filled with a plug 126 for connecting the conductive layer12 to the redistribution layer 16. The plug 126 connects theredistribution layer 16 to the top of the conductive layer 12. Theredistribution layer 16 has a substantially planar top surface 138 andbottom surface 136. The plug 126 has a top surface 134 substantiallyco-planar with the bottom surface 136 of the redistribution layer 16 insome embodiments.

The plug 126 is comprised of a chemically mechanically polished (CMP)conductive material in some embodiments. The conductive material istungsten, titanium, titanium nitride, titanium tungsten, nickelsilicide, etc. in some embodiments. The plug 126 can be provided duringfabrication of the IC die 110 or in a post-fabrication process.Advantageously, material associated with the redistribution layer 16 isnot provided in the via 124 between the redistribution layer 16 and theconductive layer 12, thereby enabling finer line width and spacing dueto uniformity in the thickness of the redistribution layer 16.

After the plug 126 is formed (e.g., by a deposition and etch backprocess), the dielectric layer 114 is deposited above the dielectriclayers 14 and the redistribution layer 16. The dielectric layer 114 isetched to provide a via 140 in some embodiments. After the dielectriclayer 18 is provided, a via 142 is provided in the dielectric layer 18by selective etching. The via 140 is larger than the via 142 in someembodiments. The under bump metallization layer 20 is provided in thevia 142 in some embodiments. The via 142 is similar to the via 42 (FIG.1)

With reference to FIG. 3, a portion of an IC die 210 is similar to theIC dies 10 and 110 discussed above with respect to FIGS. 1 and 2. The ICdie 210 includes the conductive layer 12 (e.g., a top metal layer)connected through an under bump metallization layer 220 to bumpstructure 230. In some embodiments, the bump structure 230 is a solderball or solder pillar and is similar to the bump structure 30 discussedabove. The under bump metallization layer 220 extends through a via 222in the dielectric layer 18, a via 224 in a redistribution layer 216 anda via 226 in a dielectric layer 214 in some embodiments.

The redistribution layer 216 is an aluminum pad layer in someembodiments. A feature associated with the redistribution layer 216 isprovided directly below the bump structure 230 and the under bumpmetallization layer 220. The redistribution layer 216 is similar to theredistribution layer 16 discussed above in some embodiments. In someembodiments, the redistribution layer is Cu or Al—Cu alloy.

100331 The dielectric layer 214 is similar to the dielectric layers 14and 114 discussed above in some embodiments. The dielectric layer 218 issimilar to the dielectric layer 214 and is provided above the dielectriclayer 214 and the redistribution layer 216. The under bump metallizationlayer 220 is provided after the vias 222, 224, and 226 have been formed.The under bump metallization layer 220 contacts the conductive layer 12as well as the redistribution layer 216 in some embodiments. Theredistribution layer 216 can extend across the IC die 210 to provideother connections, and yet does not have any physical contact with theconductive layer 12 due to the dielectric layer 214.

In some embodiments, the dielectric layer 218 is selectively etched toform via 228 and expose the redistribution layer 216. After the via 228is formed, the dielectric layer 218 is deposited and selectively etchedto form the via 222 and expose the redistribution layer 216.

In some embodiments, one mask is used on the redistribution layer 216 toform the vias 224 and 226 by etching. The via 224 has a smaller diameterthan via 226. Dry etching can be used to etch through redistributionlayer 216 (e.g., with an etch selective to the material of theredistribution layer 216) followed by an etch of the dielectric layer214 (e.g., with an etch selective to the material of the dielectriclayer 214).

There is no aluminum provided on the wall of the dielectric layer 214 insome embodiments. In some embodiments, the via 222 is etched in aprocess selective to the material of dielectric layer 18. IC die 210advantageously provides a copper interconnect (using the under bumpmetallization layer 220) between the bump structure and the andconductive layer 12 without requiring an aluminum plug in vias 222, 224,and 226, thereby enabling higher DC current. The under bumpmetallization layer 220 contacts aluminum side walls in the via 224associated with the redistribution layer 216.

The process can be provided in a post-fabrication bump formation processin some embodiment. The conductive layer 12 is protected by thedielectric layer 214 and the redistribution layer 216. In someembodiments, the redistribution layer 216 can be provided as apost-fabrication redistribution layer 216 combined with post-fabricationformation of the bump structure 30 for cost savings.

With reference to FIG. 4, an IC die 310 similar to the IC die 210utilizes different size vias 322, 324, and 326 compared to vias 222,224, and 226 (FIG. 3) in some embodiments. The vias 322 and 326 areselectively formed to have different sizes rather than a continuous sidewall associated with the vias 224 and 226 (FIG. 3).

With reference to FIG. 5, an IC die 410 includes a conductive layer 412,(e.g., a metal layer) similar to the conductive layer 12 (FIG. 1), adielectric layer 418 disposed below the conductive layer 412, and abarrier layer 420 disposed above the conductive layer 412 and thedielectric layer 418. The IC die 410 also includes a dielectric layer422, a redistribution layer 424, a dielectric layer 426, an under bumpmetallization layer 428, and a bump structure 430.

The dielectric layer 418 is an IDL in some embodiments. The barrierlayer 420 is a capping barrier layer, such as, a silicon nitride layer,similar to the dielectric layer 14 (FIG. 1) in some embodiments. Theunder bump metallization layer 428 is coupled through a via 431 to theredistribution layer 424. The redistribution layer 424 is coupled to anunder bump metallization plug 444 which is coupled to the conductivelayer 412. The redistribution layer 424 is similar to the redistributionlayer 16 and provided at least partially directly below the bumpstructure 430.

The dielectric layer 422 is a polyimide layer similar to the dielectriclayer 18 (FIG. 1). The under bump metallization layer 428 is a underbump metallization layer similar to the under bump metallization layer20 (FIG. 1) and is coupled to the redistribution layer 424 through thevia 430.

A via 448 is provided through the layers 426, 424, 422, and 420 byselective etching until the conductive layer 416 is reached. The underbump metallization plug 444 provides contact to the redistribution layer424 at its side walls. The plug 444 can be formed when the under bumpmetallization layer 428 is formed in a post IC fabrication process insome embodiments. The plug 444 is formed in a conformal deposition andetch back process and is the same material as the under bumpmetallization layer 428 in some embodiments. In some embodiments, theunder bump metallization plug 444 has the same thickness as the underbump metallization layer 428.

With reference to FIG. 6, a portion of an IC die 510 is similar to theIC die 210 except the redistribution layer 216 is not provided betweenthe under bump metallization layer 120 and the conductive layer 12 (FIG.3). The IC die 510 includes the conductive layer 12 (e.g., a top metallayer), the dielectric layer 214, the under bump metallization layer520, the bump structure 30, a dielectric layer 518, and a dielectriclayer 522. The dielectric layers 518 and 522 are two separate polyimidelayers similar to the dielectric layer 18 discussed above with respectto FIG. 1.

The dielectric layer 522 is provided above the dielectric layer 518 andthe under bump metallization layer 520 is provided above the dielectriclayer 518. The dielectric layer 518 is 0.2 to about 2.5 microns thickand layer 522 is 0.2 to about 2.5 microns thick. The dielectric layer518 includes a via 528, and the dielectric layer 214 includes a via 526.A via 532 is provided in the dielectric layer 522 in some embodiments.The vias 526 and 528 is formed by selective etching to reach theconductive layer 12.

A redistribution layer 524 is provided above the dielectric layer 518.After the layer 518 is formed and the vias 526 and 528 are provided, theunder bump metallization layer 520 is deposited above the layer 518 andwithin the vias 526 and 528. The under bump metallization layer 520 isselectively etched to leave the redistribution layer 524 and the underbump metallization layer 520 in the vias 526 and 528. The under bumpmetallization layer 520 and the redistribution layer 524 are structuresform the same layer in some embodiments. The under bump metallizationlayer 520 and the redistribution layer 524 are the same material (e.g.,copper material or copper alloy) in some embodiments. In someembodiments, nickel, gold, combinations thereof or other conductivematerials can be provided as the under bump metallization layer 520 andthe redistribution layer 524. Advantageously, the redistribution layer524 is provided when the under bump metallization layer 520 is providedafter the layer 518 is provided.

The dielectric layer 522 is deposited after the under bump metallizationlayer 520 and is selectively etched to form the via 532 and expose theunder bump metallization layer 520 as defined by a mask at the locationof the via 532 in some embodiments. The dielectric layer 522 is etchedto reveal the under bump metallization layer 520 for attachment of thebump structure 30. In some embodiments, the dielectric layer 522 isprovided after the bump structure 30 is formed. Advantageously, aseparate redistribution layer 16 as shown in FIG. 1, and an aluminumplug is not required and a second capping barrier layer is not required.The redistribution layer 524 extends and connects with the under bumpmetallization layer 520 or for connection to other elements. In someembodiments, the redistribution layer 524 is not covered by thedielectric layer 522.

The disclosure is described above with reference to drawings. Thesedrawings illustrate certain details of specific embodiments thatimplement the systems and methods and programs of the presentdisclosure. However, describing the disclosure with drawings should notbe construed as imposing on the disclosure any limitations that arepresent in the drawings. The embodiments of the present disclosure canbe implemented using various types of dies. No claim element herein isto be construed as a “means plus function” element unless the element isexpressly recited using the phrase “means for.” Furthermore, no element,component or method step in the present disclosure is intended to bededicated to the public, regardless of whether the element, component ormethod step is explicitly recited in the claims.

It should be noted that certain passages of this disclosure canreference terms such as “first” and “second” in connection with devicesfor purposes of identifying or differentiating one from another or fromothers. These terms are not intended to relate entities or operations(e.g., a first region and a second region) temporally or according to asequence, although in some cases, these entities can include such arelationship. Nor do these terms limit the number of possible entitiesor operations.

It should be understood that the circuits described above can providemultiple ones of any or each of those components. In addition, thestructures, circuits and methods described above can be adjusted forvarious system parameters and design criteria, such as shape, depth,width, thicknesses, material, etc. Although shown in the drawings withcertain components directly coupled to each other, direct coupling isnot shown in a limiting fashion and is exemplarily shown. Alternativeembodiments include circuits with indirect coupling between thecomponents shown.

It should be noted that although steps are described in an order, it isunderstood that the order of these steps can differ from what isdepicted. Also two or more steps can be performed concurrently or withpartial concurrence. Such variation will depend on the software andhardware systems chosen and on designer choice. It is understood thatall such variations are within the scope of the disclosure.

While the foregoing written description of the methods and systemsenables one of ordinary skill to make and use what is consideredpresently to be the best-mode thereof, those of ordinary skill willunderstand and appreciate the existence of variations, combinations, andequivalents of the specific embodiment, method, and examples herein. Thepresent methods and systems should therefore not be limited by the abovedescribed embodiments, methods, and examples, but by all embodiments andmethods within the scope and spirit of the disclosure.

1. An integrated circuit die, comprising: a metal layer; a firstpassivation layer disposed above the metal layer; a redistribution layerdisposed above the first passivation layer; and a redistribution layerplug coupled to the metal layer and disposed in a via in the firstpassivation layer, wherein a first surface of the redistribution layerplug is substantially in-plane with a second surface of the firstredistribution layer; and an under bump metallization layer coupled tothe redistribution layer above the first passivation layer at a lateraldistance from the redistribution layer plug.
 2. The integrated circuitdie of claim 1, wherein the redistribution layer plug comprisestungsten, titanium, titanium nitride, titanium-tungsten, or nickelsilicide.
 3. The integrated circuit die of claim 1, wherein theredistribution layer plug comprises copper.
 4. The integrated circuitdie of claim 3, wherein the first surface comprises tungsten, titanium,or tantalum.
 5. The integrated circuit die of claim 1, wherein the underbump metallization layer is coupled to the redistribution layer througha polyimide layer, the redistribution layer comprising, copper,aluminum, gold or mixtures thereof.
 6. The integrated circuit die ofclaim 2, wherein the under bump metallization layer is connected to themetal layer at a location directly below a bump structure attached tothe under bump metallization layer.
 7. An integrated circuit die,comprising: a metal layer; a first passivation layer disposed above themetal layer; a conductive layer disposed above the first passivationlayer; a polyimide layer disposed above the conductive layer; and anunder bump metallization layer coupled to the metal layer providedthrough the polyimide layer, the conductive layer, and the firstpassivation layer, wherein the under bump metallization layer contactsthe metal layer and the redistribution layer.
 8. The integrated circuitdie of claim 7, wherein the under bump metallization layer is providedthrough a first hole in the polyimide layer, a second hole in theconductive layer, and a third hole in the first passivation layer, thefirst hole being larger than the second hole and the second hole at abottom being substantially the same size as the third hole at a top. 9.The integrated circuit die of claim 7, wherein the under bumpmetallization layer is provided through a first hole in the polyimidelayer, a second hole in the conductive layer, and a third hole in thefirst passivation layer, the first hole being larger than the secondhole and the second hold being larger than the third hole.
 10. Theintegrated circuit die of claim 7, further comprising a secondpassivation layer above the first passivation layer and at leastpartially above the conductive layer.
 11. The integrated circuit die ofclaim 7 wherein the under bump metallization layer comprises copper. 12.An integrated circuit die, comprising: a metal layer; a barrier layerabove the metal layer; a first passivation layer disposed above thebarrier layer; a redistribution layer disposed above the firstpassivation layer; and an under bump metallization layer plug coupled tothe metal layer and disposed in a via that is provided through the firstpassivation layer, the redistribution layer, and the barrier layer,wherein a top surface of the redistribution layer plug is disposed abovea top surface of the redistribution layer.
 13. The integrated circuitdie of claim 12, further comprising: an under bump metallization layercoupled to the redistribution layer above the first passivation layer ata distance from the redistribution layer plug, wherein the under bumpmetallization layer comprises a material, the material being the samematerial as the under bump metallization layer plug.
 14. The integratedcircuit die of claim 12, wherein the under bump metallization layer isconnected to the metal layer without aluminum in the under bumpmetallization layer plug.
 15. The integrated circuit die of claim 13,wherein the under bump metallization layer plug comprises copper. 16.The integrated circuit die of claim 13, further comprising: a polyimidelayer disposed above the redistribution layer, wherein the top surfaceof the under bump metallization layer plug extends above the polyimidelayer and the redistribution layer comprises aluminum.
 17. An integratedcircuit die, comprising: a metal layer; a first passivation layerdisposed above the metal layer; a first polyimide layer disposed abovethe first a passivation layer; and an under bump metallization layercoupled to the metal layer through the first polyimide layer, whereinthe under bump metallization layer comprises at least one conductorextending across a top surface of the first polyimide layer and awayfrom an area for a solder bump or pillar for the integrated circuit die.18. The integrated circuit die of claim 17, further comprising a secondpolyimide layer having a top surface disposed above the under bumpmetallization layer and the conductor.
 19. The integrated circuit die ofclaim 17, wherein the under bump metallization layer and the conductorcomprise copper.
 20. The integrated circuit die of claim 17, wherein theconductor is not covered by a dielectric.